PDC has a long distinguished history of integrating the most advanced technologies to deliver a higher level of functionality in packages optimized for size, weight and power while maintaining backwards compatibility to preserve the investment of our customers’ programs. PDC’s 3D microelectronic packaging allows us to deliver radiation tolerant memory modules with the highest density in the market today.
PDC designs highly integrated hybrids and 3D multi-chip modules containing state of the art analog, digital and mixed signal ASICs utilizing the latest packaging technologies such as:
- Flip Chip
- Ball Grid Array
- Stacked Die
- Embedded Magnetics
This level of integration enables highly compact solutions that our customers can count on for the duration of their programs. PDC custom products are delivered to the most stringent quality assurance requirements.
PDC has been producing standard and custom hybrids containing ASIC solutions for use in military, commercial aerospace, space, and industrial applications, for more than 50 years. PDC Engineering uses advanced tools and processes coupled with years of experience to thoroughly simulate and validate our designs so that reliability is built in.