The PDC Advantage

PDC designs, manufactures, assembles, and tests all products to the highest standards, ensuring your solution works optimally and reliably, outperforming any alternative.

Ruggedization

PDC designs boards, hybrids, and multi-chip modules (MCM) to meet ruggedness and reliability levels for performance in demanding environments:

• Flyable Boards for Conduction or Air-Cooled Applications
• Extended Temperature Operation
• Conformal Coating Available
• MIL-STD-810/VITA 47 Shock and Vibration

Miniaturization

Reduce size, weight, and power (SWaP) with PDC’s multi-channel, multi-I/O, and MCMs.

• High Channel Count
• Multiple I/Os or Protocols on a Single Board
• Small Form Factors
• Small Integrated MCM/Hybrids

Integration

PDC designs integrated hybrids and multi-chip modules to include protocol, processing, memory, transceivers, and magnetics into small rugged single component solutions.

• Ceramic/Hermetic Hybrids
• Plastic Encapsulated Multi-Chip Modules
• Integrated Protocol, Memory, PHY, Magnetics

Life Cycle

With close to 50 years of experience, PDC understands the life cycle requirements of the military and aerospace industries. With a comprehensive system to manage obsolete materials, we are committed to supplying electronic products that ensure:

• Uninterrupted product availability
• Backwards hardware and software compatibility
• Configuration control

Complete Support...From Concept to Completion

• Hardware Design
• Software Design
• Thermal and Mechanical
• Analysis
• Program Management
• Manufacturing and Testing
• Qualification and Validation
• Documentation
• Product Support